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2007 05 29& 0183;& 32;Grinding, lapping, polishing, and CMP remove large irregularities from the surface. The grinding wheel or plate typically rotates at a high speed A lapping and polishing machine with variable speed.
2009 01 20& 0183;& 32;Introduction of Product Introduction of Wafer Surface Grinding Machine Model GCG300 Junichi Y amazaki Meeting the market requirements for silicon wafers with high flatness and minimal damage, which havee increasingly
Up to now, with 500 mine EPC projects, 70 kinds of ores mining technologies and experience and 20 patents, Xinhai has established overseas offices in Sudan, Zimbabwe, Tanzania, Peru and Indonesia and exported to more than 20 countries.
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